Printed-circuit board (PCB) complexity mandates performing different analysis types to ensure robust board performance. This complexity is brought on by the ever-increasing bus data rates to provide large throughput; the need for maintaining constant impedance of nets, spanning multiple form factors; the high transmission loss caused by lossy laminate materials; the high-thermal power loss and temperature rise in components and copper traces; and failure tests which need to be carried out for product qualifications. This presentation shows how these factors diminish PCB performance margins and require different types of analysis to avoid failures throughout the PCB design cycle.
Erik, Nijeboer, C.B. Distribution