Due the LMPA demand of international companies such as Intel, various consumables suppliers have developed different low melting point alloys. The main reason behind this demand was to reduce or eliminate the “Head in Pillow” defect on BGA components. The availability of this next generation low melting point alloys will give developers the possibility to use heat sensitive substrates and components which were difficult or impossible to solder with the traditional alloys such as SAC305. This presentation will highlight the history behind LMPA, Differences between LMPA’s, LMPA properties, Application areas, Application limitation and Additional benefits.
Henk Mathijssen, AQC
Klik hier om de presentatie terug te kijken
Klik hier om de PDF-versie van de presentatie te bekijken
Terug naar het programma