Wave II 11ac modules at the market today are typically in high power 11ac single band only and in odd-shape to provide 4×4 RF features. jjPlus designs the circuit to fit into standard mPCI-e size so that the parts can be easily retrofit in the slots that
Industrial SSD’s and its predicted endurance specifications
ATP’s industrial solid state drives and modules deliver dependable performance, efficient responsiveness and long usage life to accomplish mission-critical tasks. Sturdy and built to withstand rigorous operating environments, ATP SSDs come in different form factors such as 2.5” SSDs, M.2 embedded modules, mSATA, SlimSATA, eUSB and industrial
i.MX 8X on SMARC 2.0 and Qseven modules
The new benchmark for 2 – 4 watt applications The new small form factor modules based on the NXP i.MX 8X extend existing congatec i.MX8 offerings particularly for the area of ultra-low-power and highly reliable industrial applications. With the extremely power efficient ARM Cortex A35 architecture, the
NVIDIA QUADRO Embedded Preferred Partner
Based on QUADRO EMBEDDED ROADMAP components with 5 years lifetime, 10 month EOL period and LTB, 90 day PCN notification, memory longevity qualified sources, GPU Direct RDMA… ADLINK will introduce during the year 2019 between 5 to 7 modules based on: – QUADRO Pascal P1000 (GP107): 1.8
Wide Temperature 11ac/bgN modules with BT in mPCIe and M.2 format
JWX6058/JWW6051 are both based on QCA’s latest chip of 6174A-5where within the small module size (in mPCIe and in M.2, respectively), the units offer 2×2 MU-MIMO 11ac and 11bgN dual band along with BT4.2 RF capabilities. The modules are qualified for wide temperature operation range (-40°C to
Production Release of Silicon Carbide (SiC) Products
Microchip’s 700 V SiC MOSFETs and 700 V and 1200 V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC power modules. The more than 35 discrete products that Microchip has added to its portfolio are available in volume, supported by comprehensive development services, tools
DDR3 8Gbit component based memory modules
ATP Prevents DDR3 Supply Shortage with New Own-Built DDR3 8 Gbit Components and Modules As the DRAM market makes a steady migration to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high density DDR3 8 Gbit components including EOL
Extremely Low Inductance SP6LI Package
Extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules. The new package, developed specifically for the SP6LI product family, is designed to offer 2.9 nanohenry (nH) stray inductance suitable for SiC MOSFET technology and enable high current, high
Mobile PCI Express Modules with NVIDIA Quadro Embedded P-family
ADLINK’s Embedded Graphics provide GPU acceleration with embedded MXM modules and PCI Express graphic cards. ADLINK’s Embedded Graphics offer high performance, high data bandwidth, power efficiency, and longevity support to enable performance boost in a reduced hardware footprint. ADLINK’s Embedded Graphics is an idea fit for multi-display
Layerscape-based platforms for robust and industrial applications of high-speed data communication
The heart of the mainboard is the LGA module TQMLS1012AL. This mini module uses the LS1012A with a single Cortex A53 CPU. In addition to DDR3L RAM with up to 1 GB, customers have up to 256 MB of highly reliable QSPI NOR flash available. With a