Microchip’s 700 V SiC MOSFETs and 700 V and 1200 V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC power modules. The more than 35 discrete products that Microchip has added to its portfolio are available in volume, supported by comprehensive development services, tools
First global dual-mode LPWA (LTE-M, NB-IoT) module with optional 2G fallback
The industrial-grade common flexible form factor (CF3®) enables OEMs and System Integrators to build their connected products on the most scalable module platform in the world. CF3® modules provide one size, one design, one future-proof footprint across any LPWA, 4G, 3G, 2G mobile network and are available
Embedded systemen: zelf ontwikkelen of uitbesteden?
Build or Buy? Answering the First Question of Designing Embedded Products and Devices This webcast will study the benefits and challenges associated with both approaches from a technical and business perspective. It will also showcase the use of LabVIEW in product design and embedded application development throughout