The new benchmark for 2 – 4 watt applications The new small form factor modules based on the NXP i.MX 8X extend existing congatec i.MX8 offerings particularly for the area of ultra-low-power and highly reliable industrial applications. With the extremely power efficient ARM Cortex A35 architecture, the
Cooling Solutions
The specifications for Qseven, COM Express and SMARC include heatspreader definitions, the mechanical thermal interface. All the heat generated by power consuming components such as chipsets and processors is transferred to the system’s cooling via the heatspreader. This can be achieved by either a thermal connection to