Accelonix Demonstrates Non contact 3D Profilometer

6 mei 2019

Discover the Cybertechnologies CT100 – Non contact Profilometer during E&A 2019 at the Accelonix booth – 7C113.
Bring your sample for a test measurement!
The CT 100 is a compact and flexible 2 and 3D non‑contact surface profilometer. Suited to bench mounting, it has a motorized platform providing a scanning area of up to 150 mm square. A variety of optical sensors are available for this model, providing the optimum balance of working height and measurement range for particular applications.

Cybertechnologies – CT100

High – Resolution and speed 3D scanning system
150 mm scanning area
User friendly concept
Sophisticated analysis and automation software
Automated measurement tasks analyses, 2D and 3D,
step and repeat.

Typical applications are the analysis and quality control of printing processes, such as thick-flm measurement on a variety of substrate materials, volume measurement of paste depots, epoxy-flims, dots or other printed and dispensed features. Geometry and position measurement of highly contoured objects like solder bumps, microlenses, and MEMS devices, as well as ﬂatness and coplanarity analysis are other popular application

PS: On our booth you will also find solutions for EMC and RF testing, X-Ray and CT Inspection, wire bonding and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).

Click to register your free ticket. Visit us at stand 7C113

Accelonix

Accelonix BV is a leading Benelux supplier of Test and Assembly Equipment for Electronics and Micro-Electronics.

What we do

We provide equipment and solutions for:

EMC Test Equipment: Amplifiers, EFT/Burst, Surge, ESD, RF Immunity, RF Emission, MIL STD, Automotive, Antennas, ISN/CDN, GTEM, EMC Software

PCBA Inspection and Electrical Test Systems: 3D AOI and SPI, X-Ray Inspection, AXI, Flying Probe Test, JTAG/ BScan Test, Device programmers, DFx-, Test Coverage-, NPI-, Traceability & Repair Software

Micro-Assembly and Packaging Systems: Dicing, Die Bonding, Wire Bonding, Dispensing, Pull & Shear Test, Plasma Treatment, Bond Tools

Metrology: Warpage, 3D Non Contact, µ-CT Reconstruction and Metrology

Furthermore we offer local application services including:

Takaya Flying Probe Programming and Electrical Test,
Die and Wire Bonding Services
X-Ray / Computed Tomography Inspection.

Other services include equipment rental, service contracts, maintenance & repairs, calibrations and consulting

Our Partners

We are the Distributor in the Benelux for:

EMC instrumentation:

Ametek CTS, Milmega, Teseq, EM Test, IFI, Laplace, Schwarzbeck, FCC, Gauss EMI Receivers, Prana Amplifiers, MPE Filters, Lumiloop Field Probe, Chroma/QuadTech Safety Analysers

PCBA Inspection and Test Equipment:

Takaya Flying Probe Testers, Data IO Device Programmers, Visiconsult XR Count Component Counter, Goepel 3D AOI, Goepel SPI Solder Paste Inspection, Goepel AXI, Goepel JTAG/Bscan, Yxlon FeinFocus X-Ray, Aster Technologies Software, Huntron Trackers and Probers

Micro Assembly Equipment:

ADT Dicing, Dr Tresky die bonders, TPT wire bonders, Hesse Mechatronics wire bonders, Royce die sorters, Royce Bond Testers, GPD Global Dispensing, DeWeyl Bond Tools, March Plasma

Metrology Instrumentation:

CyberTechnologies, Yxlon µCT, AkroMetrix