Accelonix demonstrates TPT Wire Bonder at E&A

6 mei 2019

Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7C113.
Bring your sample for a test wire bonding!

The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

TPT – HB16

Wedge, Ball & Ribbon bonding
Gold, aluminium, silver & copper wire.
Repeatable Loop profiles
Motorized wireclamp
User friendly concept
Very flexible solution for proto & low volume

PS: On our booth you will also find solutions for EMC and RF testing, X-Ray and CT Inspection, Non contact surface measurements and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).

Click to register your free ticket. Visit us at stand 7C113

Accelonix

Accelonix BV is a leading Benelux supplier of Test and Assembly Equipment for Electronics and Micro-Electronics.

What we do

We provide equipment and solutions for:

EMC Test Equipment: Amplifiers, EFT/Burst, Surge, ESD, RF Immunity, RF Emission, MIL STD, Automotive, Antennas, ISN/CDN, GTEM, EMC Software

PCBA Inspection and Electrical Test Systems: 3D AOI and SPI, X-Ray Inspection, AXI, Flying Probe Test, JTAG/ BScan Test, Device programmers, DFx-, Test Coverage-, NPI-, Traceability & Repair Software

Micro-Assembly and Packaging Systems: Dicing, Die Bonding, Wire Bonding, Dispensing, Pull & Shear Test, Plasma Treatment, Bond Tools

Metrology: Warpage, 3D Non Contact, µ-CT Reconstruction and Metrology

Furthermore we offer local application services including:

Takaya Flying Probe Programming and Electrical Test,
Die and Wire Bonding Services
X-Ray / Computed Tomography Inspection.

Other services include equipment rental, service contracts, maintenance & repairs, calibrations and consulting

Our Partners

We are the Distributor in the Benelux for:

EMC instrumentation:

Ametek CTS, Milmega, Teseq, EM Test, IFI, Laplace, Schwarzbeck, FCC, Gauss EMI Receivers, Prana Amplifiers, MPE Filters, Lumiloop Field Probe, Chroma/QuadTech Safety Analysers

PCBA Inspection and Test Equipment:

Takaya Flying Probe Testers, Data IO Device Programmers, Visiconsult XR Count Component Counter, Goepel 3D AOI, Goepel SPI Solder Paste Inspection, Goepel AXI, Goepel JTAG/Bscan, Yxlon FeinFocus X-Ray, Aster Technologies Software, Huntron Trackers and Probers

Micro Assembly Equipment:

ADT Dicing, Dr Tresky die bonders, TPT wire bonders, Hesse Mechatronics wire bonders, Royce die sorters, Royce Bond Testers, GPD Global Dispensing, DeWeyl Bond Tools, March Plasma

Metrology Instrumentation:

CyberTechnologies, Yxlon µCT, AkroMetrix