Welcome at the Accelonix booth at E&A 2019. Enjoy a coffee or a soft drink and meet with our representatives. The following Production & Test solutions are available for demonstration: Click to register your free ticket. Visit us at stand 7C113
Accelonix
Website: http://www.accelonix.nl
Accelonix BV is a leading Benelux supplier of Test and Assembly Equipment for Electronics and Micro-Electronics.
What we do
We provide equipment and solutions for:
EMC Test Equipment: Amplifiers, EFT/Burst, Surge, ESD, RF Immunity, RF Emission, MIL STD, Automotive, Antennas, ISN/CDN, GTEM, EMC Software
PCBA Inspection and Electrical Test Systems: 3D AOI and SPI, X-Ray Inspection, AXI, Flying Probe Test, JTAG/ BScan Test, Device programmers, DFx-, Test Coverage-, NPI-, Traceability & Repair Software
Micro-Assembly and Packaging Systems: Dicing, Die Bonding, Wire Bonding, Dispensing, Pull & Shear Test, Plasma Treatment, Bond Tools
Metrology: Warpage, 3D Non Contact, µ-CT Reconstruction and Metrology
Furthermore we offer local application services including:
- Takaya Flying Probe Programming and Electrical Test,
- Die and Wire Bonding Services
- X-Ray / Computed Tomography Inspection.
Other services include equipment rental, service contracts, maintenance & repairs, calibrations and consulting
Our Partners
We are the Distributor in the Benelux for:
EMC instrumentation:
Ametek CTS, Milmega, Teseq, EM Test, IFI, Laplace, Schwarzbeck, FCC, Gauss EMI Receivers, Prana Amplifiers, MPE Filters, Lumiloop Field Probe, Chroma/QuadTech Safety Analysers
PCBA Inspection and Test Equipment:
Takaya Flying Probe Testers, Data IO Device Programmers, Visiconsult XR Count Component Counter, Goepel 3D AOI, Goepel SPI Solder Paste Inspection, Goepel AXI, Goepel JTAG/Bscan, Yxlon FeinFocus X-Ray, Aster Technologies Software, Huntron Trackers and Probers
Micro Assembly Equipment:
ADT Dicing, Dr Tresky die bonders, TPT wire bonders, Hesse Mechatronics wire bonders, Royce die sorters, Royce Bond Testers, GPD Global Dispensing, DeWeyl Bond Tools, March Plasma
Metrology Instrumentation:
CyberTechnologies, Yxlon µCT, AkroMetrix
Manufacturing Automation, Traceability and Repair software from CAD to PCBA at the Accelonix booth
If you are looking for a manufacturing automation software to speed up the process of bringing a new PCBA from CAD to your production or a solution to keep track of traceability and shorten the repair cycle, than visit Accelonix at booth 7C113. Aster Technologies EMS4.0 Software Solutions Testway Express is a fully integrated solution that enables electronic
Accelonix Demonstrates Non contact 3D Profilometer
Discover the Cybertechnologies CT100 – Non contact Profilometer during E&A 2019 at the Accelonix booth – 7C113. Bring your sample for a test measurement! The CT 100 is a compact and flexible 2 and 3D non‑contact surface profilometer. Suited to bench mounting, it has a motorized platform providing a scanning area of up to 150
EM Test and Teseq EMC generators – Visit the Accelonix Booth 7C113
Accelonix provides a broad range of compact integrated generators for simulation and testing according to various EMC standards and phenomena. We provide EMC test solutions for various applications in commercial, industry, automotive, military, telecom and space industries. During the E&A 2019 we will demonstrate the following simulators for ESD, Surge/Burst/PQT and RF conducted and radiated
X-Ray Inspection Demonstrations at the Accelonix booth 7C113
Discover the YXLON Cougar EVO during E&A 2019 at the Accelonix booth – 7C113 . Bring your sample and make the invisible visible! The YXLON Cougar EVO was designed to provide the “best-in-class” inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and
Accelonix demonstrates TPT Wire Bonder at E&A
Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7C113. Bring your sample for a test wire bonding! The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball