In recent years the electronics manufacturing industry has been challenged by a drastic change in time to market demand. The most recently introduced method for smarter and dynamic electronics production is the integration of a high speed paste or glue jetter inside the SMD Pick & Place machine.

In addition to faster time to market, manufacturers are being confronted with challenging production tasks and high mix/medium volume, 2,5D component placement and production of foils and large size PCB’s.

Based on our latest technology and user experiences we will introduce how this production method can offer a solution so companies can stay cost effective in technically challenging times.

Kevin Domancich, Essemtec AG (on behalf of SMD-TEC)

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