Accelonix BV is a solution provider for many types of test and production applications in electronic manufacturing and development.
Since more than 25 years, we have accumulated particular expertise in the high technology fields of EMC and RF test, automated test equipment and software for PCB assembly as well as automated assembly equipment for microelectronics, hybrid, chip-on-board and battery bonding.

We provide equipment and solutions for:

• Micro-Elektronics Assembly: Dicing, Dispensing, Die Sorting, Die & Wire Bonding, Battery Bonding &Bond Testing
• PCBA Inspection & Test: Solder Paste , 3D AOI & X-Ray Inspection, Flying Probe Test, JTAG Test, Device Programming and Software for DfX, NPI & Traceability
• Metrology: Non-Contact Surface Metrology, Thermal Warpage/Strain & X-Ray �CT
• EMC: ESD & Transients , RF Emissions, RF Immunity, Measurement Chambers and Test Cells

Accelonix is also service partner for prototype assembly of microelectronics (die and wire bonding, battery bonding) and for testing of PCBAs (X-Ray Inspection, Flying Probe and JTAG).

During the E&A 2023 we will showcase :

• Bonding equipment for semiconductors, hybrids and chip-on-board
• EMC simulators for EFT/Burst and surge transients and ESD
• RF conducted immunity testing
• X-Ray Inspection: bring your own sample and see what's inside!
• Software for DfT & Manufacturing (DfX), test coverage analysis and NPI