Digi Connect EZ is a click-to-connect solution with 1, 2, 4, 8, 16 or 32 serial ports. Digi Connect EZ Mini, 2 and 4 are available with software-selectable for RS-232/422/485 communication, as well as optional LTE, Wi-Fi and industrial specifications (C1D2).
Modern secure serial connectivity
Most companies are not replacing their equipment they are updating the way they talk to it. Digi Connect EZ modernizes operational infrastructure with expanded network connectivity and functionality for todays applications.
Compact Embedded box for smart manufacturing solutions
ACS-500 is the new embedded box PC, powering by 11th Gen. Intel Core i3/i5 processor. It is perfectly well-prepared for being operated in AIOT smart factory.
Non-Coaxial Dual Motor Controller
Geehy introduced the APM32F411 series, a lineup of high-performance and high-adaptability MCUs.
PoE PD Conformance Testing: supports 4-wire pair 802.3bt
Power-over-Ethernet Conformance tester Fully automatic 802.3at and 802.3bt Conformance testing as well as all measurement tools needed to troubleshoot and ensure your PoE device conforms to the standard and will work will any PoE-PSE.
Smart display mini series
In order to meet the user's space requirements on small devices, TDO designed a highly cost-effective and highly integrated driver board, which integrates basic functions in a drive board with size: 48(L)*32.2( W)*3.2(H) (mm).
Mitsubishi Electric Develops SBD-embedded SiC-MOSFET with New Structure for Power Modules
Mitsubishi Electricannounced that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC-MOSFET) embedded with a Schottky barrier diode (SBD), which the company has applied in a 3.3 kV full SiC power module, the FMF 800 DC -66 BEW for large industrial equipment such as railways and DC power systems. Samples began shipping on May 31...
Wire Bonder Demonstrations at the Accelonix Booth
Discover the TPT HB16 Semi Automatic fine wire bonder at the Accelonix booth 7B105 duringElectronics & Applications 2023. The HB16 Semi-Automaticseries bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. TPT HB16 Wedge, Ball &...
Demonstrations with EMC Test generators at the Accelonix Booth
Discover the EM Test and TESEQ EMC Generators at the Accelonix booth 7B105.
Small IPS displays bright and in color with SPI interface
Compact graphic display TFT015-22AI is bright and sharp, but economical in power consumption. Its IPS panel scores highly thanks to its all-round viewing angle and readability in sunlight. The active area of the IPS colour display measures just 28 mm square.
- Vorige pagina
- 25
- 26
- 27
- 28 ...
- 148
- Volgenda pagina