Chip-scale and wafer-level packaging will lead to more flexibility for SSL manufacturers as Plessey adopts an application-specific focus for its silicon-based LEDs.
Plessey has announced that it will deliver LEDs in chip-scale packages (CSPs) for its gallium-nitride-on-silicon (GaN-on-Si) LEDs and the result will be a new series called AS-LED with the prefix implying an application-specific focus. The company also plans wafer-level packaging products, and both technologies could enable lower-cost solid-state lighting (SSL) product designs.
The new CSP LEDs will be part of Plessey’s Magic (Manufactured on GaN-on-Si I/C) portfolio of products.
For more information please contact Alcom electronics at info@alcom.nl