In the ever changing world of LED lighting you are challenged to keep up with the latest technology. One of the technologies is to keep reducing the heat dissipation and increase light output. Many manufacturers have introduced new packages where the LED DIE is directly connected to the solder pad, giving higher lumen density with improved performance. But, what are the implication for the engineer and for the production of these new LED’s. In this presentation you will be informed about how to overcome these challenges.
Laurent Petrus, Avnet Silica