TGEL™ 600 OFFERS BEST-IN-CLASS THERMAL RESISTANCE

TGEL™ 600 OFFERS BEST-IN-CLASS  THERMAL RESISTANCE Door: Telerex Nederland B.V.

Now cooling the most demanding high wattage 
components, the new, versatile Laird™ Tgel™ 600
offers best-in-class thermal resistance in a variety 
of situations ranging from minimum bondline 
(~20µm) applications to large, fixed gap challenges 
up to 2mm. It is an all-in-one dispensable material 
solution meeting all thermal needs and ideal for 
effective, reliable heat transfer. With 6.4 W/mK bulk 
thermal conductivity, good vertical stability, and 
exhibiting minimal pump out, Tgel™ 600 can also be 
used within the same system package to serve as a 
gap filler and cool secondary components. It delivers 
low thermal resistance (<0.06°C-cm2/W). Tgel 600 
is available in cans, pails, cartridges, and syringes 
and finds ideal applications in data centers, IGBTs, 
consumer electronics, telecom systems, and more. 
Review this exciting new entry in our thermal 
products line.