The ongoing trend to deploy ICs in more complex and harsher applications, entails precise evaluation of solder joint reliability of components subjected to vibration loads. For this, a good understanding of the Printed Circuit Board (PCB) vibrational motion during board level vibration life test is of utmost importance. This can only be achieved by a well characterized vibration test set up. As such, the vibration motion can be recorded by using a contact based measurement approach, i.e. using an accelerometer, or a contactless measurement configuration, i.e. using a LASER Doppler Vibrometer (LDV). This session presents assessment of both measurement techniques and reveals vibration measurement related pitfalls that an analyst needs to be aware of during vibration testing.
Varun Thukral, NXP Semiconductors