Technologies, both in semiconductor wafer technology and assembly, tend to become more complex due to higher integration. In parallel, use conditions are getting more demanding due to new application opportunities. As a consequence, specifically in automotive electronics, reliability margins are reducing and the well-established AEC-Qxx standards have to evolve to a next level. To support this evolution, the relevance of understanding Physics of Degradation or Change in relation to commonly used reliability stress test methods will be discussed.
René Rongen, NXP Semiconductors