In a growing number of applications conventional heatsinks are no longer sufficient when heat is concentrated, your products’ space and weight have to be reduced, and heat dissipation is decentralized. It becomes even more critical if passive cooling is mandatory. Therefore, HALA’s thermal management solutions also focus on an optimized heat transfer and heat spreading up to the heatsink and the ambient.
The applications relating to this presentation are diverse and heat sources are of diverse scenarios. These include FBGA and other electronic packages, for example in 5G telecommunications, MOSFET and IGPB packages, power modules in power electronics, or battery cells and CPUs for future autonomous driving, as well as TEC modules in medical technology and many more.
With a broad understanding of thermal management, Batenburg Applied Technologies and HALA help device manufacturers in the Dutch and Belgium industry in the design and realization of efficient, durable and high performing thermal design-ins. And not to forget our joint motivation to make our customers´ products more efficient and sustainable. Every degree of improving efficiency counts.
Wilhelm Pohl, HALA Contec GmbH (on behalf of Batenburg Applied Technologies)
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