Thermal management is a critical aspect when working with SiC (Silicon Carbide) power devices, as they tend to generate higher heat compared to traditional silicon devices. We would like to discuss some key thermal management strategies for SiC power devices:
- Efficient Heat Sinks
- Advanced Packaging Techniques
- Thermal Interface Materials (TIM)
- Controlled Ambient Temperature
- Active Cooling Systems
- Optimized Circuit Layout
- Temperature Sensing and Monitoring
By implementing these thermal management strategies, engineers can enhance the reliability and performance of SiC power devices in various applications.
Kiran Kumar Ramachandra, Qorvo (on behalf of Ecomal)
Track: 
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