Wireless communication depends on RF technologies that have specific requirements at different technology levels, starting from substrates on which devices and circuits are developed. The Silicon-on-Insulator (SOI) technology is a rapidly rising candidate technology to accommodate these requirements for RF applications. Quality, precision and rapidity of tests are also critical for the time-tomarket industrial cycle. This talk addresses both the advantages of the SOI technology for RF and wireless communication and also the new techniques to characterize the new-engineered Si-based substrates targeting the continuously growing wireless market.
Jean-Pierre Raskin, Louvain School of Engineering on behalf of Electro Rent Europe