Use the wrong Surface Finish and it you may have downstream issues during assembly or longer-term reliability issues.
But how to make the right choice? For this weeks TECHNOLOGY THURSDAY , we will help you answer this question!
What are the options?
HAL Leadfree
+ the highest level of solderability
- not the best choice with small via holes or when the board exceeds a normal thickness
Chemical Ni/Au
+ a flat surface, good solderability and acceptable shelf life
- complicated with a higher risk of defects, expensive and not for applications which are subject to shocks, bending or strong vibrations
Chemical Ag
+ a flat surface with very good solderability
- susceptible to sulphur dioxide (SO²) which tarnishes the surface and creates the AgS² layer
What would you choose?
Go here to read our full blog: https://www.eurocircuits.com/blog/which-surface-finish-fits-your-design/
Enjoy your day !
