Now cooling the most demanding high wattage
components, the new, versatile Laird™ Tgel™ 600
offers best-in-class thermal resistance in a variety
of situations ranging from minimum bondline
(~20µm) applications to large, fixed gap challenges
up to 2mm. It is an all-in-one dispensable material
solution meeting all thermal needs and ideal for
effective, reliable heat transfer. With 6.4 W/mK bulk
thermal conductivity, good vertical stability, and
exhibiting minimal pump out, Tgel™ 600 can also be
used within the same system package to serve as a
gap filler and cool secondary components. It delivers
low thermal resistance (<0.06°C-cm2/W). Tgel 600
is available in cans, pails, cartridges, and syringes
and finds ideal applications in data centers, IGBTs,
consumer electronics, telecom systems, and more.
Review this exciting new entry in our thermal
products line.
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